SEMICON Europa 2025, Europe’s flagship semiconductor event, returns to Messe München from November 18–21, co-located once again with productronica. This year’s edition places a strong spotlight on advanced packaging, fab management, and MEMS & imaging sensor technologies—sectors vital to the resilience and competitiveness of the European semiconductor ecosystem.

At the heart of the event is the Advanced Packaging Conference (APC), which showcases key innovations such as 2.5D and 3D stacking, chiplet integration, and heterogeneous packaging. These technologies are essential for improving power efficiency, heat dissipation, and overall performance in high-demand applications like AI and high-performance computing.

Key APC topics include:

• Geopolitical impacts on global packaging markets
• New materials and techniques for wafer- and panel-level packaging
• Innovations in packaging for silicon photonics
• Digital twin and AI applications to optimize yield and reliability
• Next-gen testing, inspection, and metrology solutions

Meanwhile, the Fab Management Forum (FMF) addresses pressing challenges in semiconductor manufacturing, with a focus on smart manufacturing, automation, and sustainability. The FMF aims to arm industry professionals with tools to increase production efficiency while navigating workforce shortages and global supply chain complexities.

FMF discussion areas include:

• End-to-end manufacturing excellence strategies
• Green manufacturing initiatives and circularity
• Developing and retaining skilled talent in semiconductor fabs
• Digital transformation and Industry 4.0 integration

The MEMS & Imaging Sensors Summit promises to be a hub for breakthroughs in sensor innovation, emphasizing the rise of AI-driven sensing and multi-sensor data fusion. Applications span automotive safety, wearable health tech, and next-gen smart devices. Europe’s prominent role in this sector will be a recurring theme.

Highlighted summit topics:

• AI-integrated sensor technologies
• Cross-domain sensor data fusion for enhanced analytics
• Emerging applications in healthcare and automotive
• Europe’s technological edge in MEMS and imaging

Laith Altimime, President of SEMI Europe, underlined the critical need for international cooperation in strengthening Europe’s semiconductor future: “These platforms bring together innovators, policy-makers, and industry leaders to secure sustainable growth and supply chain stability for Europe.”

Registration is now open for all three events. Attendees can look forward to vibrant networking sessions, including the SEMI Networking Night and the anticipated 20 Under 30 Award ceremony, celebrating emerging talent in the semiconductor field.

As the industry evolves rapidly, SEMICON Europa 2025 offers a critical juncture for thought leadership, technological collaboration, and strategic foresight—cementing Europe’s position as a key player in the global semiconductor landscape.