Amkor and TSMC expand their partnership, collaborating on advanced semiconductor packaging in Arizona, enhancing innovation and boosting the U.S. semiconductor ecosystem.
Amkor Technology and TSMC have announced an expanded partnership to collaborate on advanced packaging technologies in Arizona. This collaboration focuses on semiconductor innovation and strengthening the United States' semiconductor ecosystem.
Under the agreement, TSMC will utilize Amkor’s turnkey advanced packaging and test services at a new facility in Peoria, Arizona, supporting TSMC’s wafer fabrication in Phoenix. This proximity aims to reduce production cycles and enhance customer flexibility in front- and back-end semiconductor manufacturing.
Technologies like TSMC's Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®) will play a key role in serving high-demand industries such as high-performance computing, AI, and mobile applications.
Giel Rutten, CEO of Amkor, emphasized that this partnership aims to further innovation in packaging while building resilient supply chains within the United States. The collaboration exemplifies the companies’ shared vision for comprehensive technology alignment, benefiting semiconductor manufacturers globally.
TSMC’s Dr. Kevin Zhang highlighted the importance of geographic flexibility, ensuring advanced manufacturing capabilities are easily accessible across various regions, ultimately benefiting global clients and enhancing semiconductor manufacturing in the U.S.
Comments (0)