HANMI Semiconductor is expanding its advanced packaging equipment portfolio with the launch of the 2.5D TC Bonder 40, a new tool designed to support the high-precision bonding requirements of AI semiconductors and high-performance computing applications.

The system is aimed at 2.5D packaging processes, a technology area that has become increasingly important as chipmakers integrate larger dies, memory stacks and multiple chiplets into compact, high-performance architectures. HANMI plans to supply the equipment to global foundries and outsourced semiconductor assembly and test companies, strengthening its position in the fast-growing AI system semiconductor packaging market.

The launch follows the company’s recent additions to its bonding lineup, including the FC Bonder 75 and FC Bonder 3.5. With the 2.5D TC Bonder 40, HANMI is broadening its offering for customers developing next-generation AI chips that require advanced die placement, thermal compression bonding and multi-chip integration.

As AI processors become larger and more complex, packaging equipment is becoming a decisive part of semiconductor performance and manufacturability.

2.5D packaging is gaining wider adoption because it allows different semiconductor components to be placed close together on an interposer or substrate, improving bandwidth, power efficiency and system performance. This approach is already associated with leading technologies such as TSMC’s CoWoS and Intel’s EMIB, both of which support advanced integration for AI accelerators, graphics processors and data centre chips.

Global technology companies, including Nvidia, AMD, Broadcom, Marvell and Apple, are using advanced packaging concepts to support in-house AI chip development. As a result, demand is rising not only for packaging capacity, but also for specialised equipment capable of handling larger dies and tighter tolerances.

The 2.5D TC Bonder 40 is designed for chip-on-wafer processes used in CoWoS-type architectures. According to HANMI, the tool can process dies ranging from ultra-small 3 x 3 mm components to ultra-large 40 x 40 mm dies. This wide handling range is important for customers working across different chip designs, from compact components to large AI processors with demanding bonding requirements.

The equipment includes Auto Conversion technology, enabling continuous processing of different chip types. This can help manufacturers improve flexibility and reduce changeover complexity when working with varied production demands. The system also introduces a Reel Feeder Loading process, designed to enhance operational efficiency and support smoother equipment utilisation.

Another notable feature is the optional Fluxless Bonding function. In advanced semiconductor packaging, reducing micro defects is critical because small imperfections can affect yield, reliability and long-term device performance. Fluxless bonding can help improve process cleanliness and quality consistency, particularly in applications where high reliability is essential.

• 2.5D packaging supports high-bandwidth integration for AI and HPC chips.
• Large die handling enables bonding of components up to 40 x 40 mm.
• Auto Conversion improves flexibility across different chip formats.
• Fluxless Bonding can help reduce defects and improve reliability.
• U.S. expansion will place HANMI closer to major AI semiconductor customers.

HANMI also plans to establish a local subsidiary, HANMI USA, by the end of the year. The move is strategically important, as the United States is home to many AI chip developers, foundries, memory companies and back-end semiconductor specialists. By building a stronger local presence, HANMI aims to collaborate with customers earlier in the chip planning process and align its equipment roadmap with market needs.

The broader market outlook reinforces the importance of this investment. Advanced packaging technologies, including 2.5D and 3D integration, are expected to grow strongly through 2030 as chip performance gains increasingly depend on packaging innovation rather than transistor scaling alone. For equipment suppliers, this creates opportunities in bonding, placement, inspection and process automation.

For HANMI Semiconductor, the 2.5D TC Bonder 40 represents more than a product launch. It is part of a strategy to extend the company’s influence from AI memory packaging into system semiconductor packaging, where demand is expanding rapidly. As AI chips become larger, more power-dense and more integrated, tools that can deliver precision, throughput and reliability will play a central role in the next phase of semiconductor manufacturing.

Image suggestion: an advanced semiconductor packaging line with a thermal compression bonder placing large AI dies on wafers, surrounded by cleanroom equipment and high-tech inspection systems.