ASML is moving to expand its semiconductor equipment portfolio beyond its flagship EUV lithography systems, according to Chief Technology Officer Marco Pieters. The company is now focusing research on advanced packaging tools used in AI semiconductor production.

As AI processors are now assembled from multiple specialized chips, connected and bonded together rather than being packed onto a single, larger silicon die, packaging—once a low-margin afterthought—has become a critical element in both performance and cost. This shift is putting advanced packaging at the forefront of AI semiconductor production.

ASML's dominance in EUV technology, which uses light to etch intricate circuit designs onto silicon wafers, has been well established, and the company is continuing to innovate in this area. However, ASML is also setting its sights on the long-term future, looking to expand into chip packaging, bonding, and related areas that will be critical in the next 10 to 15 years.

Marco Pieters emphasizes that ASML is planning beyond the next few quarters, with a focus on the next 10 to 15 years, ensuring that they remain ahead of industry demands. The company is working on rolling out AI inside its tools, aiming for smarter machine control software and enhanced inspection during production, which will help increase efficiency and speed in chip production.

In addition to EUV lithography, ASML's XT:260 scanning tool, which targets advanced memory chips for AI processors, was launched last year. The company is also exploring further innovations for stacked chip setups, although much of this is still in the research phase. As chip architecture shifts from traditional flat designs to vertical stacks connected by nanoscale links, ASML is poised to play a significant role in evolving packaging solutions.

As the semiconductor industry pivots towards more advanced packaging for AI chips, companies like TSMC are tapping into these technologies to assemble Nvidia’s leading AI chips. ASML’s involvement in this area positions the company to be a major player in the future of chip manufacturing, moving beyond its traditional EUV market.

While many of these projects are still in the research phase and could take time to yield significant returns, ASML’s long-term focus on innovation positions it to lead in the semiconductor market for many years to come. The company’s commitment to developing advanced tools for chip packaging and bonding underscores the growing importance of packaging in the production of high-performance AI semiconductors.