At CES 2026, Samsung Electro-Mechanics highlighted its response to the AI boom with plans to expand its chip packaging capabilities, specifically FC-BGA substrates and MLCCs. As artificial intelligence continues to reshape industries, demand for components like these is soaring, especially for AI servers and data centers that require advanced, high-density chip packaging. CEO Chang Duck-hyun noted that the company is preparing to run its FC-BGA production lines at full capacity in the second half of 2026 to meet this surge in demand.

FC-BGA substrates play a crucial role in connecting complex semiconductor chips to mainboards, making them essential for high-performance applications, including AI. The company is also reviewing plans to increase production capacity as demand from AI-related industries, including networking chips, power semiconductors, and GPUs, is expected to dominate the market, potentially accounting for up to 70% of FC-BGA demand. This aligns with the rapidly expanding AI-driven data center industry, which is increasingly becoming the backbone of cloud computing services and data storage in e-commerce and digital industries.

In addition to expanding its chip packaging capabilities, Samsung Electro-Mechanics is exploring its potential role in the growing humanoid robot market. As AI systems evolve into more physical forms, including humanoid robots, components such as actuators, sensors, and cameras are becoming increasingly important. The company is already in discussions to supply camera modules, MLCCs, and FC-BGA to humanoid robot manufacturers. This diversification could position Samsung Electro-Mechanics as a key player in the emerging robotics industry, which is poised to play a significant role in industries such as healthcare, manufacturing, and retail, transforming supply chains and e-commerce delivery systems.

As part of its expansion plans, Samsung Electro-Mechanics will also begin mass production of camera modules at its newly constructed facility in Mexico in the second half of 2026. The company aims to accelerate its development in advanced electronics, contributing to both the AI and robotics sectors, which are expected to be pivotal in the next wave of technological innovation. These advancements are essential to support the increasing demand for smarter consumer electronics, autonomous vehicles, and robotics systems used in e-commerce logistics.

In conclusion, Samsung Electro-Mechanics is actively preparing for the future of AI by expanding its chip packaging capacity and diversifying into robotics components. These moves reflect the company’s commitment to supporting the increasing demand for advanced semiconductor components driven by AI advancements, positioning itself at the forefront of these groundbreaking industries. As AI continues to evolve and shape new markets, Samsung Electro-Mechanics is strategically positioning itself to meet the technological needs of the next-generation e-commerce landscape.