SCHMID Group, a global leader in electronics manufacturing solutions, has announced a significant expansion of its advanced packaging portfolio to meet the growing demands of the AI-driven semiconductor industry. With the rapid rise of AI technologies reshaping electronics manufacturing, this strategic move positions SCHMID as a crucial enabler of next-generation packaging and substrate innovation.

Driven by market shifts and an anticipated compound annual growth rate (CAGR) of 10% in the semiconductor and advanced packaging sector, SCHMID is enhancing its InfinityLine product family to support cutting-edge server boards and advanced IC-substrates. These substrates are central to the AI revolution, enabling higher performance, miniaturization, and efficient thermal management in modern electronics.

SCHMID’s updated portfolio includes new and evolved systems tailored to meet the complex requirements of AI server boards and advanced packaging. Among the new introductions:

• InfinityLine L+: A Chemical Mechanical Planarization (CMP) solution designed for panel-level substrates, ensuring planar surfaces necessary for multilayer interconnects.
• InfinityLine P+: Next-generation single panel plating equipment optimized for AI-Server-PCB demands.
• InfinityLine C+: A rising contributor to revenue, reflecting its alignment with high-growth markets.

These additions complement existing offerings such as the InfinityLine H+ (top-selling solution) and InfinityLine V+, which addresses high-complexity PCB manufacturing. Together, they form a robust toolkit that allows SCHMID’s customers to scale advanced packaging capabilities in line with AI’s performance and integration requirements.

Beyond the InfinityLine, SCHMID is also advancing glass core substrate technologies—a key enabler of next-generation chip architectures. The company leverages its QuantumLine and SCHMID-AVACO Plasma Equipment to deliver high-yield glass core production, essential for Chip-on-Wafer-on-PCB (CoWoP) technologies that are increasingly demanded by AI and high-performance computing (HPC) markets.

Through its ET-Board technology, SCHMID enables panel-level Cu-damascene manufacturing, allowing miniaturization at industrial scale. This process is critical for developing ultra-fine interconnects required in advanced semiconductor packaging.

“The AI era is fundamentally transforming the electronics and semiconductor industries,” said Christian Schmid, CEO of SCHMID Group. “With our expanded InfinityLine portfolio and advanced substrate technologies, we are ready to lead this transformation alongside our customers.”

While 2025 is expected to be a transition year, SCHMID anticipates strong revenue growth from 2026 onwards, primarily driven by AI-optimized products. The AI server board segment alone is expected to grow at a 20% CAGR, and IC-substrates at 15%, outpacing the traditional PCB market growth rate of 8%.

With AI requiring faster data processing and more efficient power delivery, the shift toward high-performance substrates is inevitable. SCHMID’s integrated, environmentally conscious manufacturing systems offer not only technological superiority but also lower cost of ownership—key considerations for customers scaling up AI infrastructure.

Founded in 1864 and headquartered in Freudenstadt, Germany, the SCHMID Group continues to lead with a forward-looking strategy rooted in innovation, quality, and sustainability. As the electronics industry gears up for the next wave of AI-centric growth, SCHMID’s expanded product suite reinforces its position as a pivotal partner for companies navigating this transformation.