SCHMID Group has introduced its Any Layer ET process for full panel-level advanced packaging, targeting the growing demand for ultra-fine interconnects, high-density substrates and scalable manufacturing platforms for AI and high-performance computing applications. The technology is designed to support next-generation substrate production where precision, reliability and surface planarity are becoming critical performance factors.

The announcement reflects the increasing importance of advanced packaging in the semiconductor value chain. As AI infrastructure, advanced servers and heterogeneous integration become more demanding, chip performance depends not only on silicon, but also on the ability to connect components efficiently through advanced substrates, redistribution layers and vertical interconnects.

Any Layer ET is a full panel-level damascene embedded trace process. Unlike conventional mSAP and SAP approaches, it enables precise copper embedding inside dielectric layers. This can improve line definition, electrical performance, reliability and planarity in multilayer package architectures. These characteristics are particularly important for advanced IC substrates, panel-level packaging, glass-core substrates and high-density interconnect applications.

Advanced packaging is becoming a strategic enabler for AI-era electronics, where interconnect density and manufacturing scalability are as important as chip design itself.

The process combines several key manufacturing steps, including Deep Reactive Ion Etching for via and trench formation, Physical Vapor Deposition for titanium and copper seed layers, Electrochemical Deposition for copper filling and Chemical Mechanical Polishing for surface planarisation. SCHMID’s platform is built around its InfinityLine C+, PlasmaLine, InfinityLine P+ and InfinityLine L+ equipment portfolio.

For manufacturers, the value of this integrated approach lies in process control and scalability. Full panel-level production can support cost-efficient high-volume manufacturing, while single-panel handling and touchless transport are designed to improve cleanliness, reduce defectivity and support stable yields across large-format panels.

• Ultra-fine line capability supports next-generation redistribution layers.
• Embedded copper traces can improve electrical performance and reliability.
• Full panel-level processing offers a route toward scalable production.
• Glass-core compatibility positions the platform for future substrate architectures.

The technology is relevant for organic, hybrid and glass-core substrate platforms. Glass-core packaging is attracting strong interest because of its potential to support dimensional stability, fine features and next-generation interconnect performance. As the semiconductor industry looks for ways to overcome system-level bottlenecks, substrate innovation is becoming a central part of performance scaling.

SCHMID does not manufacture substrates itself. Instead, the company develops and licenses the process technology while supplying the equipment required for industrial implementation. This positions SCHMID as an enabling technology provider for substrate manufacturers, OSATs and semiconductor companies seeking to industrialise advanced packaging processes.

The company will also present related developments at ECTC 2026 in Orlando, Florida. Roland Rettenmeier, Chief Sales Officer of SCHMID Group, is scheduled to present “InfinityBoard – A Panel-Level Glass-Core Packaging Platform for Ultra-Fine RDL and Vertical Interconnect Integration.” The session will focus on panel-level glass-core packaging, ultra-fine redistribution layers and embedded trace damascene processing.

The timing is significant. ECTC is one of the major global conferences for semiconductor packaging and interconnect technologies, bringing together substrate manufacturers, OSATs, semiconductor companies and equipment suppliers. Presenting Any Layer ET in this environment places SCHMID’s technology within the wider conversation on how packaging will support future AI and HPC architectures.

For the packaging sector, the announcement is a reminder that “packaging” increasingly spans more than consumer goods, food, healthcare or logistics. In electronics, advanced packaging is becoming one of the most important frontiers for innovation, enabling higher performance, better power distribution and more compact system integration.

SCHMID’s Any Layer ET process highlights how manufacturing precision, materials engineering and equipment integration are shaping the future of semiconductor packaging. As AI-driven computing demand accelerates, scalable advanced packaging platforms may become essential to unlocking the next generation of electronic performance.