Siemens has won the prestigious Best of Show Award for 'Packaging: Design' at the 2026 Chiplet Summit for its Innovator3D IC™ solution. This software is recognized for advancing 2.5D and 3D chiplet integration, providing a fast and predictable path for planning and heterogeneous integration of ASICs and chiplets using the latest packaging technologies.

The award was presented during the fourth annual Chiplet Summit, held at the Santa Clara Convention Center. Chiplet Summit, organized by Semper Technologies, is the industry’s largest event focused on chiplet technologies, catering to technologists working with chiplets in processor, memory, communication chips, and AI device designs.

Siemens' Innovator3D IC™ solution stands out for its ability to streamline the design process by providing a unified approach to optimizing and validating heterogeneous dies, chiplets, interposers, and packages. According to AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software, 'This recognition reinforces our mission to deliver cutting-edge technologies that radically accelerate how our customers develop the next generation of semiconductors.'

Chuck Sobey, general chair of the Chiplet Summit, praised the Innovator3D IC for its lifecycle coverage and the breadth of industry-standard data models. As multi-die integration grows more complex, this solution allows designers to innovate with greater confidence and speed, enabling more efficient chiplet-based designs.

Siemens' commitment to advancing packaging technology through innovations like Innovator3D IC is helping reshape how chiplet integration is approached, making it faster, more reliable, and scalable. The company’s efforts in 2.5D and 3D packaging are setting new standards for the semiconductor industry, driving the next wave of chip innovation.

The Innovator3D IC solution provides a robust platform that can handle the increasing complexity of semiconductor designs while delivering the precision needed for successful chiplet integration. The software's ability to optimize different materials, technologies, and substrates in a unified workflow is a significant advancement in the industry, reducing time-to-market for new chips and enhancing overall product quality.