The U.S. Department of Commerce has announced a substantial investment of up to $300 million to advance semiconductor packaging technologies. This initiative aims to bolster innovation in semiconductor research, development, and manufacturing, with a particular focus on advanced packaging solutions. :contentReference[oaicite:0]{index=0}

The funding will be allocated to three entities, each receiving up to $100 million:

• Absolics: Based in Covington, Georgia, Absolics is developing glass core substrate panel manufacturing through its Substrate and Materials Advanced Research and Technology Packaging Program. :contentReference[oaicite:1]{index=1}
• Applied Materials: Located in Santa Clara, California, Applied Materials leads a team of ten organizations to develop and scale a disruptive silicon-core substrate technology for advanced packaging and 3D heterogeneous integration. :contentReference[oaicite:2]{index=2}
• Arizona State University: Situated in Tempe, Arizona State University is working on utilizing fan-out-wafer-level-processing for microelectronics packaging. :contentReference[oaicite:3]{index=3}

These projects focus on advanced substrates, which are essential for the seamless assembly of semiconductor chips, enabling high-bandwidth communication, efficient power delivery, and effective heat dissipation. :contentReference[oaicite:4]{index=4}

Secretary of Commerce Gina Raimondo emphasized the importance of this investment, stating, "Emerging technology like AI requires cutting-edge advances in microelectronics, including advanced packaging. Through these proposed investments, we are positioning the United States as a global leader in designing, manufacturing, and packaging the microelectronics that will fuel tomorrow’s innovation." :contentReference[oaicite:5]{index=5}

Laurie Locascio, Under Secretary of Commerce for Standards and Technology and Director of the National Institute of Standards and Technology, added, "Advanced packaging is essential to the development of the advanced semiconductors that are the drivers of emerging technology like artificial intelligence." :contentReference[oaicite:6]{index=6}

This investment is part of a broader strategy to enhance the U.S. semiconductor industry's competitiveness and resilience, ensuring the nation remains at the forefront of technological innovation. :contentReference[oaicite:7]{index=7}