NAPCO, a leading player in the packaging industry, has taken a significant step towards revolutionizing its digital packaging capabilities. At the recent drupa exhibition, the company announced its acquisition of a Beam 2 digital die cutting system from Highcon. This innovative technology will be installed at its Sparta facility in North Carolina, USA, and is set to be shipped shortly. With this move, NAPCO is poised to further solidify its position as a pioneer in the digital packaging sector.

The Highcon system is designed to eliminate the need for physical dies, significantly reducing turnaround times from order to delivery. This breakthrough technology also offers unlimited structural creativity and design possibilities, allowing NAPCO to expand its product range into new categories. As an extension of its existing digital printing workflow, the Highcon system will enable NAPCO to offer customers cost-effective, customizable, and quick-turn solutions.

According to Rob Proffit, President of NAPCO USA, "Eliminating the need for physical dies will significantly lessen the turn-time from order to delivery. It also allows unlimited structural creativity and design. As an extension to our existing digital packaging equipment, the Highcon will expand our current reach into digital finishing, broadening our range of products into other categories." This move is expected to have a significant impact on the company's production agility and ability to respond to changing market demands.

Joe DeBoy, VP of Sales, NAPCO USA, added, "Today's customers require cost-effective, customizable, quick-turn solutions. The Highcon delivers on all of this. With no tooling and quicker lead-times, this piece of equipment will allow us to capture most of the digital manufacturing we were losing previously. We're very excited about the opportunities the Highcon will allow us to go after." The Highcon system is expected to be a game-changer for NAPCO, enabling the company to offer customers a more comprehensive range of digital packaging solutions.

The acquisition of the Highcon system is just the latest example of NAPCO's commitment to innovation and staying ahead of the curve in the packaging industry. With its focus on digital packaging capabilities, NAPCO is well-positioned to meet the evolving needs of its customers and stay ahead of the competition.