Samsung Invests $280M in Japan for Advanced Chip Packaging

Samsung commits $280 million investment over 5 years in Japan for cutting-edge chip packaging research, strengthening global semiconductor leadership.

Samsung Invests $280M in Japan for Advanced Chip Packaging

It was reported in March that Samsung was looking at establishing a packaging facility in Kanagawa Prefecture, where it already has a research and development center, to deepen ties with Japanese makers of chipmaking equipment and materials.

Japan's industry ministry said it would provide Samsung subsidies worth up to ¥20 billion as it looks to support the revitalization of domestic chip manufacturing.

Samsung's investment comes at a time of easing tensions between South Korea and Japan as the United States encourages allies to work together to counter China's growing technological prowess.

The chipmaker began bolstering its advanced chip packaging department last year. Companies are racing to develop advanced packaging techniques, which involve combining components in a single package to improve overall chip performance.

The facility will allow Samsung to strengthen its leadership in chips and partner with packaging-related companies based in Yokohama, the head of Samsung's chip business Kyung Kye-hyun said in the city's announcement.


Keywords

Samsung Electronics , chip packaging , Japan investment , advanced technology , semiconductor research

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